One Billion SMARTRAC RFID Inlays and PRELAM® Products Employing Wire-embedding Technology Supplied
7. June 2013
Amsterdam, October 17, 2012 – SMARTRAC N.V., the leading developer, manufacturer, and supplier of RFID transponders and inlays, announced that it has produced and supplied more than one billion RFID inlays and PRELAM® products manufactured with its patented wire-embedding technology.
SMARTRAC’s proprietary and patented wire-embedding technology has proven itself to be the manufacturing technology of choice for contactless antennas with the highest product performance for high-profile applications. Card manufacturers and players in the high-security printing industry consider wire-embedding technology the de-facto standard for products which have to fulfil the highest quality, reliability, and durability requirements.
RFID inlays and PRELAM® products employing wire-embedding technology are used for the production of high-security documents such as e-passports, RFID-based national ID Cards, electronic permanent resident cards, etc. SMARTRAC’s wire-embedding products have also proven their superiority in the contactless payment industry, in automated fare collection, loyalty programs, and multi-application cards.
“Wire-embedding has been one of the drivers of success for RFID in several application fields. We are proud to have reached the production milestone of one billion products with wire-embedding and would like to sincerely thank our customers and business partners for their support and contribution to our success over the past years,” said Martin Kuschewski, Member of the Group Executive Team and Head of Business Unit eID.
Relying on RFID inlays and PRELAM® products manufactured with SMARTRAC’s proprietary and patented wire-embedding technology not only provides customers with superior products but also ensures security in terms of the underlying technology concept, patents, and manufacturing competence.
SMARTRAC will continue to nurture wire-embedding technology in the future in order to advance it to the next level of technological excellence.