Smartrac Launches High-Security PRELAM® based on NXP’s MIFARE® DESFire® EV2 Chip Family 2. March 2016
Smartrac has announced the launch of a new PRELAM® product based on NXP’s MIFARE® DESFire® EV2 chip family. The new inlay is compliant with all relevant ISO standards and ideally suited for cards and other form factors. The pre-laminate comes with a typical read/write distance of up to 10 cm (4 inches) and was designed for public transport, access control, payment and loyalty applications.
Utilizing Smartrac’s patented wire-embedding antenna technology, the latest PRELAM product combines all the benefits the MIFARE DESFire EV2 chip has to offer. This applies particularly to the IC’s benchmark security features, its inherent durability, and enhanced electrical performance in combination with superior antenna and interconnection technology of Smartrac. The chip enables selectable cryptographic methods including single DES, 2KTDES, 3KTDES and AES128, offering 2K, 4K and 8K EEPROM size and full MIFARE DESFire® EV1 backward compatibility. Furthermore, the IC offers improved multi-application features with MIsmartApp, enabling enhanced key management, and thus new business models through the seamless integration of additional services.
Read more in Smartrac’s offical press release.